The organization of technology ambassadors at Technoprobe, which Joe Parks will lead, will be essential to represent, align, and develop Technoprobe’s product technology portfolio on a larger scale, making a decisive contribution to the future challenges we face in the worlds of chiplets, silicon photonics, thermal solutions… and much more.

As Technology Ambassador, Joe will be the link between the Technology organization and our most important stakeholders, such as clients, finance, partners, strategic suppliers, and government organizations.

With a Ph.D. in Electrical and Computer Engineering and nearly 30 years at Intel, Joe Parks has held significant and strategic roles in the semiconductor world. Most recently, Joe was Vice President of Technology Development and Director of Intel’s Oregon Assembly Test Development Factory. He led a large team of 1,400 people tasked with developing cutting-edge technologies in Advanced Packaging and Testing, including enhanced thermal test solutions related to Singulated Die Testing.

His joining our great team and his decision to invest in and believe in Technoprobe are two important signals about our future.

A future full of challenging opportunities where Technoprobe will be a major player in the technological world shaping the future ahead.

We warmly welcome Joe, with whom we will face our upcoming challenges.